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专利名称：DEVICE AND METHOD FOR PROCESSING
MATERIAL BY MEANS OF LASER RADIATION
发明人：BISCHOFF, MARK,MÜHLHOFF,
DIRK,STOBRAWA, GREGOR
申请号：EP08716514.8申请日：20080313公开号：EP2136749A2公开日：20091230
摘要：The invention relates to a device for processing material by means of laserradiation, comprising an emitting laser radiation source (S) emitting pulsed laser radiation(3) for interacting with the material (5), an optics system focusing the pulsed laserradiation (4) in the material (5) on an interaction center (7), wherein the laser pulses in thezones (8) surrounding the respectively associated interaction centers (7) interact with thematerial (5) such that material (5) is separated in the interaction zones (8), furthercomprising a scanning device (10) adjusting the location of the interaction center in thematerial (5), and a control device (17) controlling the scanning device (10) and the laserradiation source (S) such that a cut surface (9) is generated in the material (5) by thestringing together of interaction zones (8), the control unit (17) controlling the laserradiation source (S) and the scanning unit (10) such that adjacent interaction centers (7)are located at a spatial distance of a ≤ 10 μm from one another.
申请人：CARL ZEISS MEDITEC AG
地址：Göschwitzer Strasse 51-52 07745 Jena DE
国籍：DE
代理机构：Breit, Ulrich
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