MPXA4250AC6U资料

Freescale SemiconductorTechnical Data

MPX4250ARev 6, 12/2006

Integrated Silicon Pressure SensorManifold Absolute Pressure SensorOn-Chip Signal Conditioned,Temperature Compensatedand Calibrated

The MPX4250A/MPXA4250A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder.

The MPX4250A/MPXA4250A series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of

applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining

techniques, thin-film metallization and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on-chip integration make the Freescale sensor a logical and economical choice for the automotive system engineer.Features •••••••••

1.5% Maximum Error Over 0° to 85°C

Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems

Patented Silicon Shear Stress Strain Gauge

Temperature Compensated Over -40° to +125°C

Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules

Durable Epoxy Unibody Element or Thermoplastic Small Outline, Surface Mount Package

Ideal for Non-Automotive Applications

Turbo Boost Engine Control

Ideally Suited for Microprocessor or Microcontroller-Based Systems

ORDERING INFORMATION

Device Type

Options

Case No.

MPX Series Order Number

MPXA4250A6UMPXA4250A6T1MPXA4250AC6UMPXA4250AC6T1

MPX4250A MPXA4250ASERIES

INTEGRATEDPRESSURE SENSOR

20 TO 250 kPA (2.9 TO 36.3 psi)

0.2 TO 4.9 V OUTPUTSMALL OUTLINE PACKAGESMPXA4250A6U/6T1CASE 482-01MPXA4250AC6U/C6T1CASE 482A-01SMALL OUTLINE PACKAGE

PIN NUMBERS

1234

N/C(1), (2)

VS GNDVOUT

5(2)6(2)7(2)8

N/CN/CN/CN/C

1.Pin 1 in noted by the notch in the lead.2.Pins 1, 5, 6, and 7 are internal device connections. Do not connect to external circuitry or ground.

Typical Applications

UNIBODY PACKAGESPacking Options

RailsTape & Reel

RailsTape & Reel

Device Marking

MPXA4250AMPXA4250AMPXA4250AMPXA4250A

SMALL OUTLINE PACKAGE(1) (MPXA4250A SERIES)

Basic Absolute, Element OnlyElements Ported Absolute, Axial PortElements

482482482A482A

MPX4250ACASE 867-08MPX4250APCASE 867B-04UNIBODY PACKAGE(2) (MPX4250A SERIES)

Basic Absolute, Element OnlyElement

Ported Absolute, PortedElements

867867B

MPX4250AMPX4250AP

——

MPX4250AMPX4250AP

UNIBODY PACKAGE PIN NUMBERS

123

VOUT(1)GNDVS

456

N/C(2)N/C(2)N/C(2)

1.The MPXA4250A series pressure sensors are available in the basic element package or with pressure port fitting. Two packing options are offered for each type. 2.The MPX4250A series pressure sensors are available in the basic element package or with pressure port fittings providing mounting ease and barbed hose connections.

1.Pin 1 in noted by the notch in the lead.2. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground.

© Freescale Semiconductor, Inc., 2006. All rights reserved.

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VS

SensingElement

Thin FilmTemperatureCompensation

andGain Stage #1

Gain Stage #2

andGroundReferenceShift Circuitry

VOUT

GND

Pins 4, 5, and 6 are NO CONNECTS for unibody Device

Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device.

Figure1. Fully Integrated Pressure Sensor Schematic

Table1. Maximum Ratings(1)

Rating

Maximum Pressure(2) (P1 > P2)Storage TemperatureOperating Temperature

1. TC = 25°C unless otherwise noted.

2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

SymbolPMAXTSTGTA

Value1000-40 to +125-40 to +125

UnitkPa°C°C

MPX4250A2

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Table2. Operating Characteristics (VS = 5.1 VDC, TA = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in Figure3 required to meet electrical specifications.)

Characteristic

Differential Pressure Range(1)Supply Voltage(2)Supply Current

Minimum Pressure Offset(3)@ VS = 5.1 VoltsFull Scale Output(4)@ VS = 5.1 VoltsFull Scale Span(5)@ VS = 5.1 VoltsAccuracy(6)SensitivityResponse Time(7)

Output Source Current at Full Scale OutputWarm-Up Time(8)Offset Stability(9)

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

2. Device is ratiometric within this specified excitation range.

3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.

4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.

5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Output deviation at any temperature from a straight line relationship with pressure over the specified pressure range.

•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the

minimum or maximum rated pressure, at 25°C.

•TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. •TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.•Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.

7. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. •Linearity:

(0 to 85°C)

SymbolPOPVSIOVOFF

Min204.85—0.133

Typ—5.17.00.204

Max2505.35100.2

UnitskPaVDCmAdcVDC

(0 to 85°C)

VFSO

4.82..966

VDC

(0 to 85°C)

VFSS

—4.692—

VDC

(0 to 85°C)

—∆V/∆ΡtRIO+——

——————

—201.00.120±0.5

±1.5—————

%VFSSmV/kPamsecmAdcmsec%VFSS

Table3. Mechanical Characteristics

Characteristics

Weight, Basic Element (Case 867)

Weight, Small Outline Package (Case 482)

Typ4.01.5

UnitGramsGrams

MPX4250A

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Freescale Semiconductor

3

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+5 V

FloroSiliconeDie Coat

Wire Bond

Die

P1

Stainless SteelMetal CoverEpoxyCase

Vout

Vs

IPS

OUTPUT

Lead FrameSealed Vacuum Reference

P2

RTV Die Bond

1.0 µF0.01 µFGND470 pF

Figure2. Cross Sectional Diagram (Not to Scale) Figure2 illustrates the absolute pressure sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.

The MPX4250A/MPXA4250A series pressure sensor operating characteristics and internal reliability and

qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability.

Figure3. Recommended Power Supply Decoupling and

Output Filtering

(For additional output filtering, please refer to Application

Note AN16.Contact the factory for information regarding media compatibility in your application.

Figure3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller.

Figure4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over temperature range of 0° to 85°C using the decoupling circuit shown in Figure3. The output will saturate outside of the specified pressure range.

5.04.54.03.5Output (Volts)3.02.52.01.51.00.50

MINTransfer Function:VOUT = Vs* (0.004 x P-0.04) ± ErrorVS = 5.1 Vdc

TEMP = 0 to 85°CMAXTYPMPX4250A4

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0102030405060708090100110120130140150160170180190200210220230240250260Pressure (ref: to sealed vacuum) in kPa

Figure4. Output vs. Absolute Pressure

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Transfer Function Nominal Transfer Value: VOUT = VS (P × 0.004 - 0.04) ± (Pressure Error × Temp. Factor × 0.004 × VS)VS = 5.1 V ± 0.25 VDCTemperature Error Band

4.03.0

TemperatureErrorFactor

2.01.00.0

-40

-20

0

20

40

60

80

100120140Temperature in C°

NOTE: The Temperature Multiplier is a linear response from 0× to -40°C and from 85° to 125°C.

Temp- 400 to 85+125

Multiplier313

Pressure Error Band

5.04.03.02.01.00-1.0-2.0-3.0-4.0-5.0

PressureError(kPa)

0255075100125150175200225250

Pressure(kPa)

Pressure20 to 250 kPaError (Max)±3.45 (kPa)

MPX4250A

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INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total solder reflow process. It is always recommended to design design. The footprint for the surface mount packages must be boards with a solder mask layer to avoid bridging and the correct size to ensure proper solder connection interface shorting between solder pads.between the board and the package. With the correct

Footprint, the packages will self align when subjected to a

0.100 TYP 8X2.54

0.66016.76

0.060 TYP 8X1.52

0.3007.62

0.100 TYP 8X2.54

inchmm

SCALE 2:1

Figure5. SOP Footprint (Case 482)

MPX4250A6

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PACKAGE DIMENSIONS

-A-45D8 PL0.25 (0.010)MTBSAS-B-8G1NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.INCHESMINMAX0.4150.4250.4150.4250.2120.2300.0380.0420.100 BSC0.0020.0100.0090.0110.0610.0710˚7˚0.4050.4150.7090.725MILLIMETERSMINMAX10.5410.7910.5410.795.385.840.961.072.54 BSC0.050.250.230.281.551.800˚7˚10.2910.5418.0118.41SNCPIN 1 IDENTIFIERJKMH-T-SEATINGPLANEDIMABCDGHJKMNSCASE 482-01ISSUE O

SMALL OUTLINE PACKAGE

-A-45D8 PL0.25 (0.010)MTBSASN-B-8G1NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.INCHESMINMAX0.4150.4250.4150.4250.5000.5200.0380.0420.100 BSC0.0020.0100.0090.0110.0610.0710˚7˚0.4440.4480.7090.7250.2450.2550.1150.125MILLIMETERSMINMAX10.5410.7910.5410.7912.7013.210.961.072.54 BSC0.050.250.230.281.551.800˚7˚11.2811.3818.0118.416.226.482.923.17SWVCJKMPIN 1 IDENTIFIERH-T-SEATINGPLANEDIMABCDGHJKMNSVWCASE 482A-01ISSUE A

SMALL OUTLINE PACKAGE

MPX4250A

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PACKAGE DIMENSIONS

CRMB-A-NPIN 1SEATINGPLANE123456POSITIVE PRESSURE(P1)NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.DIMENSION -A- IS INCLUSIVE OF THE MOLDSTOP RING. MOLD STOP RING NOT TO EXCEED16.00 (0.630).INCHESMILLIMETERSMINMAXMINMAX0.5950.63015.1116.000.5140.53413.0613.560.2000.2205.085.590.0270.0330.680.840.0480.01.221.630.100 BSC2.54 BSC0.400.0140.0160.360.6950.72517.6518.4230˚ NOM30˚ NOM0.4750.49512.0712.570.4300.45010.9211.430.0900.1052.292.66L-T-FGD6 PL0.136 (0.005)MJSTAMDIMABCDFGJLMNRSSTYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEXSTYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPLY 5. +VOUT 6. OPENSTYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPLY 5. -VOUT 6. OPENCASE 867-08ISSUE N

UNIBODY PACKAGE

MPX4250A8

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PACKAGE DIMENSIONS

PAGE 1 OF 2CASE 867B-04ISSUE GUNIBODY PACKAGEMPX4250A

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PACKAGE DIMENSIONS

PAGE 2 OF 2CASE 867B-04ISSUE GUNIBODY PACKAGEMPX4250A10

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NOTES

MPX4250A

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MPX4250ARev. 612/2006

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