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专利名称：METHOD OF FORMING AN ELECTRONIC
DEVICE INCLUDING REMOVING ADIFFERENTIAL ETCH LAYER
发明人：Leo Mathew,Dharmesh Jawarani申请号：US12435947申请日：20090505
公开号：US20090280588A1公开日：20091112
专利附图：
摘要：A method of forming an electronic device can include forming a metallic layerover a side of a workpiece including a substrate, a differential etch layer, and a
semiconductor layer. The differential etch layer may lie between the substrate and thesemiconductor layer, and the semiconductor layer may lie along the side of the
workpiece. The process can further include selectively removing at least a majority of thedifferential etch layer from between the substrate and the semiconductor layer, andseparating the semiconductor layer and the metallic layer from the substrate. Theselective removal can be performed using a wet etching, dry etching, or electrochemicaltechnique. In a particular embodiment, the same plating bath may be used for plating themetallic layer and selectively removing the differential etch layer.
申请人：Leo Mathew,Dharmesh Jawarani
地址：Austin TX US,Round Rock TX US
国籍：US,US
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