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Combined emissivity and radiance measurement for t

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专利内容由知识产权出版社提供

专利名称:Combined emissivity and radiance

measurement for the determination of thetemperature of a radiant object

发明人:James Anthony O'Neill,Jyothi Singh申请号:US08/363143申请日:19941223公开号:US05738440A公开日:19980414

摘要:A system and method of measurement of emissivity and radiance of a wafer in arapid thermal processing chamber enables determination of wafer temperature andcontrol of temperature of the wafer. Mirrors enclose the chamber and reflect radiationfrom lamps within the chamber to heat the workpiece of interest. One or more viewingports are provided in one of the mirrors to allow for the egress of radiant energyemitted by the wafer. The wavelength of the exiting radiation is selected by an opticalfilter having a passband which passes radiation at wavelengths emitted by the wafer whileexcluding radiation emitted by heating lamps. A chopper having surface regions differingin their reflectivity and transmissivity is positioned along an optical path of radiationpropagating through the one or more ports, this resulting in a pulsation of detectedradiation. The ratio of the detected intensities of the radiation pulses is used todetermine wafer reflectance based on reflectivity and transmissivity of the reflectiveportion of the chopper. The maximum intensity of radiation is also taken as a measure ofradiance. The reflectance is employed to calculate the emissivity, and the emissivity incombination with the radiance are employed to calculate the wafer temperature.

申请人:INTERNATIONAL BUSINESS MACHINES CORP.

代理机构:Perman & Green, LLP

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